SD-2010, is an Electromechanical Fully Automatic Solder Dipping System.

The System is capable of capable of Solder Dipping, Wash & Rinse, Drying of singulated units &

offload to a Tube unloader.

ERGONOMICS DESIGN

• Compact Machine Size

• Regional exhaust is available for each process

• Can be employ in Clean room environment

VERSATILE PERFORMER

• System can be integrate with tube Loader or connect directly

  to an IN-65 (Trim & Laser Mark System)

• High yield rate due as compared to conventional batch Solder Dipping

• Dipping speed can be tune easily via servo control

USER FRIENDLY

• Error identification base on Touch screen Photo Recognition

EASE OF MAINTENANCE

• Design to achieve max. accessibility to all components

• Easy removal of gripper chucks for cleaning